NVIDIA/Mellanox MCP7Y50-N00A Compatible 800G OSFP 8 x 100G PAM4 IHS/Finned Top to 4 x 200G OSFP 2 x 100G PAM4 RHS/Flat Top InfiniBand NDR Passive Copper Breakout Cable, 0.5m (2ft)

Product Highlights

• Compatible alternative to NVIDIA/Mellanox MCP7Y50-N00A
• 800G connectivity at 800Gbps
• Interface configuration: 800G OSFP (IHS/Finned Top) to 4x 200G OSFP (RHS/Flat Top)
• Fixed length and part number: 0.5m (2ft), MCP7Y50-N00A
• Cable construction: Passive Breakout DAC
• Conductor specification: 30AWG
• Maximum power consumption: 0.1W (800G End)0.1W (200G Per End)
• Minimum bend radius: 26mm

Specifications

Signal and Lane Configuration

The listed modulation format is 8x 100G PAM4 to Quad 2x 100G PAM4. Both host interfaces must be configured for the same aggregate rate and lane arrangement. A connector that fits mechanically does not by itself guarantee that the remote port supports this encoding or breakout mode.

Passive Copper Operation

A passive DAC has no separate optical conversion stage. Its low-power, low-latency operation is useful for short equipment links, but the assembly must remain within the length and signaling mode accepted by both hosts.

Length Selection and Installation Planning

The 0.5m (2ft) length is suited to closely aligned ports where excessive slack would obstruct airflow or complicate dressing. Measure the actual port-to-port path before choosing MCP7Y50-N00A; even a short assembly must retain the specified bend radius and should never be pulled tight behind the equipment.

Position Within the Length Range

MCP7Y50-N00A is the shortest of 4 verified length options in this family. It is the preferred choice when the port positions are close and cable slack must be kept to a minimum. The next option is MCP7Y50-N001 at 1m (3ft), adding 0.5m for a less direct routing path; selecting it unnecessarily would leave more cable to dress.

Interoperability and Configuration Checks

Check three layers before deployment: the host must accept the cable identification, the port must support the stated aggregate rate, and the lane configuration must match the attached interfaces. On breakout hardware, also confirm channelization and the mapping of every branch. These checks are particularly important when similar-looking ports operate at different speeds or under different firmware settings. For this assembly, the listed conductor specification is 30AWG; the minimum bend radius is 26mm; the stated power consumption is 0.1W (800G End)0.1W (200G Per End); the jacket material is PVC.

Power and Thermal Planning

The rated power consumption is 0.1W (800G End)0.1W (200G Per End). Include this load in the host-port power and thermal budget, especially in densely populated switches. Maintain front-panel clearance and do not bundle the cable so tightly that it obstructs airflow around the connectors.

Cable Construction and Routing

This assembly uses 30AWG conductors, PVC jacket, minimum bend radius 26mm. These mechanical characteristics affect how the cable should be dressed behind the equipment. Avoid sharp edges, excessive ties and repeated tight bends close to the connector boots.

Network and Protocol Considerations

The intended application is determined by the host interface and protocol support. Listed interface and protocol references include OSFP MSA, IEEE 802.3ck, CMIS v4.0. Confirm that the host firmware and port configuration support the same operating mode.

Breakout Port Mapping

The 800G OSFP (IHS/Finned Top) to 4x 200G OSFP (RHS/Flat Top) configuration divides the high-speed interface into multiple lower-speed connections. Verify the upstream lane assignment, downstream port speeds and breakout setting on the host before connecting the assembly. Each branch must attach to the correct remote interface.

Ordering Information

Specify the OEM part number and fixed length, then provide the intended host configuration if the link uses channelized or breakout ports. Separate part numbers should be used for separate lengths. This gives the compatibility review enough information to check both the physical assembly and the intended operating mode. Quantity and any labeling instructions should be attached specifically to MCP7Y50-N00A.

NVIDIA/Mellanox Compatibility and Factory Testing

The verification process combines digital identification with a live link test and diagnostic observation. Host model, hardware revision and software release are useful inputs because qualification behavior can change between platform generations; those details allow platform-specific requirements to be reviewed before the cable is packed. The check includes link stability and diagnostic indications, followed by a final inspection of both ends.

Shipping and Lead Time

Standard configurations normally ship within one to three working days, while production quantities are confirmed with the order. Delivery can be arranged by courier, air freight or sea freight, and goods may instead be handed to an appointed forwarder or shipped on the customer’s courier account.

Quality Assurance and Packaging

Functional inspection covers identification, link establishment and the condition of both connector assemblies. The cable is then protected against dust and connector damage and packed without sharp bends. Labels can include the customer reference and host-platform note when requested for a controlled deployment. Neutral packaging and customer-specific packing documentation are available on request.

Frequently Asked Questions