NVIDIA/Mellanox MCP7Y70-H001 Compatible 400G OSFP 8 x 50G PAM4 IHS/Finned Top to 4 x 100G QSFP56 2 x 50G PAM4 InfiniBand HDR Passive Copper Breakout Cable, 1m (3ft)

Product Highlights

• Compatible alternative to NVIDIA/Mellanox MCP7Y70-H001
• 400G connectivity at 400Gbps
• Interface configuration: OSFP (IHS/Finned Top) to 4x QSFP56
• Fixed length and part number: 1m (3ft), MCP7Y70-H001
• Cable construction: Passive Twinax
• Conductor specification: 30AWG
• Maximum power consumption: 0.1W (OSFP End) 0.1W (QSFP56 Per End)
• Minimum bend radius: 26mm

Specifications

Signal and Lane Configuration

The listed modulation format is 8x 50G-PAM4 to Quad 2x 50G-PAM4. Both host interfaces must be configured for the same aggregate rate and lane arrangement. A connector that fits mechanically does not by itself guarantee that the remote port supports this encoding or breakout mode.

Length Selection and Installation Planning

At 1m (3ft), MCP7Y70-H001 is a practical choice for direct connections within one rack. Route the cable along the intended management path rather than pulling it diagonally across adjacent connectors, and leave enough clearance for insertion, removal and front-panel airflow.

Position Within the Length Range

MCP7Y70-H001 occupies the middle of this family between MCP7Y70-H00A at 0.5m (2ft) and MCP7Y70-H01A at 1.5m (5ft). It adds 0.5m over the shorter option for extra routing clearance, while the next longer version adds another 0.5m. Measure the managed path and choose this version when its reach is sufficient without creating the slack associated with the longer assembly.

Interoperability and Configuration Checks

Check three layers before deployment: the host must accept the cable identification, the port must support the stated aggregate rate, and the lane configuration must match the attached interfaces. On breakout hardware, also confirm channelization and the mapping of every branch. These checks are particularly important when similar-looking ports operate at different speeds or under different firmware settings. For this assembly, the listed conductor specification is 30AWG; the minimum bend radius is 26mm; the stated power consumption is 0.1W (OSFP End) 0.1W (QSFP56 Per End); the jacket material is PVC (OFNR).

Power and Thermal Planning

The rated power consumption is 0.1W (OSFP End) 0.1W (QSFP56 Per End). Include this load in the host-port power and thermal budget, especially in densely populated switches. Maintain front-panel clearance and do not bundle the cable so tightly that it obstructs airflow around the connectors.

Cable Construction and Routing

This assembly uses 30AWG conductors, PVC (OFNR) jacket, minimum bend radius 26mm. These mechanical characteristics affect how the cable should be dressed behind the equipment. Avoid sharp edges, excessive ties and repeated tight bends close to the connector boots.

Network and Protocol Considerations

The intended application is determined by the host interface and protocol support. Listed interface and protocol references include OSFP MSA, IEEE 802.3cd, CMIS v4.0. Confirm that the host firmware and port configuration support the same operating mode.

Breakout Port Mapping

The OSFP (IHS/Finned Top) to 4x QSFP56 configuration divides the high-speed interface into multiple lower-speed connections. Verify the upstream lane assignment, downstream port speeds and breakout setting on the host before connecting the assembly. Each branch must attach to the correct remote interface.

Passive Copper Operation

A passive DAC has no separate optical conversion stage. Its low-power, low-latency operation is useful for short equipment links, but the assembly must remain within the length and signaling mode accepted by both hosts.

Ordering Information

Specify the OEM part number and fixed length, then provide the intended host configuration if the link uses channelized or breakout ports. Separate part numbers should be used for separate lengths. This gives the compatibility review enough information to check both the physical assembly and the intended operating mode. Quantity and any labeling instructions should be attached specifically to MCP7Y70-H001.

NVIDIA/Mellanox Compatibility and Factory Testing

The verification process combines digital identification with a live link test and diagnostic observation. Host model, hardware revision and software release are useful inputs because qualification behavior can change between platform generations; those details allow platform-specific requirements to be reviewed before the cable is packed. Where supported by the host, link stability and diagnostic indications are reviewed together with the established link.

Shipping and Lead Time

Available stock is generally dispatched within one to three working days after order confirmation, with production lead times advised for larger quantities. International express, air cargo and sea freight can be selected according to destination and carton volume; customer courier accounts and nominated forwarders are also accepted.

Quality Assurance and Packaging

Functional inspection covers identification, link establishment and the condition of both connector assemblies. The cable is then protected against dust and connector damage and packed without sharp bends. Labels can include the customer reference and host-platform note when requested for a controlled deployment. Neutral packaging and customer-specific packing documentation are available on request.

Frequently Asked Questions